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PSECE
21 - 23 Jun 2017
SMX Convention Center, Manila, Philippines

Find us at Booth 255!

Photonics
31 Jul - 4 Aug 2017
Sands Expo & Convention, Singapore
Find us at Booth A15!

Click for more information!

Committed to Service
 
The LDP150 Large Device Press is especially designed for large radiation detectors using compression bonding.

The device is pressed at room temperature, preserving the initial high accuracy alignment and parallelism.
 
With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.
 
The FC300 High Force Die / Flip Chip Bonder is a newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm.

The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrate. It features also Nanoimprinting Lithography (NIL) capabilities.
 
With a post-bonding accuracy of ± 0.5 µm using passive alignment method, the TRIAD 05 AP provides development and production capabilities on a single upgradeable and cost-effective platform with configurations ranging from the manual-loading version to the fully automatic in-line solution.

It features a broad range of bonding processes: Global or In-Situ Reflow, Thermo Compression (max. 5N), UV curing and Thermo Sonic bonding.
 
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.

The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding and other innovative options.
 
The FC300R is an automated version of the basic model of the High Force FC300; it addresses the needs of the pre-production environment.

The FC300R offers production capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking. With the unmatched post-bond accuracy of ± 0.5 µm, across the entire force range of the machine (up to 4,000N), the FC300R is the ideal tool for 3D-IC applications using high density TSV.
 
 
The Nano imPrinting Stepper NPS300 is a cutting-edge lithography solution that combines advantages of E-Beam-Resolution with high throughput and low cost of ownership.

The NPS 300 is a very flexible system available as a manually loaded machine or as a fully automated system. The automated stamp pick up, allows printing different pattern from different stamps on a wafer within a single cycle.
The NPS300 is optimized for the cost-effective replication of micro or nanometer scale structures.