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Photonics
31 Jul - 4 Aug 2017
Sands Expo & Convention, Singapore
Find us at Booth A15!

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The T-6000 Die Bonder is an all purpose system for R&D, pilot and medium size production.
Die handling is standard from Wafer, Waffle-Pack and Gel-Pack. Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.