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Semicon SEA 2019
7 - 9 May 2019
We are at Booth 212!

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The T-6000 Die Bonder is an all purpose system for R&D, pilot and medium size production.
Die handling is standard from Wafer, Waffle-Pack and Gel-Pack. Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.