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3D Profilers

Automatic and manual semiconductor process control

  • Automatic wafer load / unload
  • 6" and 8" wafers, 12" on request
  • Auto wafer alignment
  • Semi-automatic measurement sequence:
    • Start up to 25 wafer measurement in a single operation
    • Pattern dimensions (Bump width / length / height, photoresist aperture size)
    • Step height, and trasparent film thickness
    • Bump roughness

Custom report format:

  • Excel or text result output or html
  • Display min/max, coplanarity, in spec/out of spec
  • Result suitable for chip per chip, wafer per wafer, cassette per cassette analysis
  • Temporal process evaluation

Click here for more information.