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The TMAP DUAL 3D 300 A is a unique metrology and inspection tool available to the semiconductor industry capable of addressing all customer measurement requirements for MEMS and 3D packaging. The TMAP is highly flexible, accurate, and repeatable. The heart of this tool is based on multi-sensor heads which include different technologies in the same integrated tool. As an example, double IR microscopy is coupled with reflection and transmission IR Illumination. The inspection technology allows the TMAP to detect cracks around the TSV, and inside the silicon layers. Our EFEM is able to handle standard or Semi- Standard products as well as wafer frame in 300mm. FOGALE has a continuing development effort that has tracked and satisfied customer requirements and stays in front of the next production needs.