Questions? Call us at +65 6425 6611
APP Systems Services APP Systems Services
  • HOME
  • COMPANY
    • ABOUT APP
  • PRODUCTS
    • Semiconductor Manufacturing
    • Vacuum Technology
    • Optics Manufacturing
    • Industrial Process & Solutions
    • Research Engineering
    • Biotechnology
  • MEDIA
    • News
    • Events
  • MARKETS
  • CAREERS
  • CONTACT
Login / Register
0 items / $0.00
Menu
APP Systems Services APP Systems Services
0 items / $0.00
Click to enlarge
Home Semiconductor Manufacturing Packaging, Test & Metrology Device Bonders ACCµRA M: New Manual Flip-Chip Bonder
Matching Networks
Back to products
ACCµRA OPTO: High Accuracy Flip-Chip Bonder 0.5 μm
SET

ACCµRA M: New Manual Flip-Chip Bonder

The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm accuracy.

This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.

Add to Wishlist loading
Product added! Browse Wishlist
The product is already in the wishlist! Browse Wishlist
Categories: Semiconductor Manufacturing, Device Bonders
Share:
  • Description
  • Additional information
  • You may also like
Description

Highlights

  • Accuracy* (± 3 μm)
  • Process controlled thanks to closed loop systems
  • Easy to use
  • Granite structure offering high stiffness
  • Vertical arm avoiding lateral shift during bonding
  • Small footprint on open platform

Key Benefits

  • Open platform with simple user interface on touchscreen
  • Quick start for new applications
  • Superimposed images for easy manual alignment
  • Bonding controlled by the machine to guarantee a high repeatability from sample to sample

Process Capabilities

Main bonding processes

  • Flip-chip bonding
  • Die bonding
  • Pick and place
  • Thermocompression
  • UV curing
  • Reflow
  • Gold, Gold/Tin, Indium, Copper
Additional information
Brand

SET

You may also like

LINKS

Home
Products
Contact
Press Release

NEWSLETTER

Tel                 
+65 6425 6611
Fax +65 6560 6616
Service Hotline +65 6225 5277
 Email sales@appsystems.com.sg

11 Toh Guan Road East
#03-01 APP Enterprise Building
Singapore 608603

APP Systems Services Pte Ltd 2021 By Pixel Mechanics. Retail eCommerce Solution.
  • HOME
  • COMPANY
    • ABOUT APP
  • PRODUCTS
    • Semiconductor Manufacturing
    • Vacuum Technology
    • Optics Manufacturing
    • Industrial Process & Solutions
    • Research Engineering
    • Biotechnology
  • MEDIA
    • News
    • Events
  • MARKETS
  • CAREERS
  • CONTACT
  • Compare
  • Login / Register

Sign in

close

Lost your password?

No account yet?

Create an Account
Start typing to see products you are looking for.