Highlights
- Accuracy* (± 3 μm)
- Process controlled thanks to closed loop systems
- Easy to use
- Granite structure offering high stiffness
- Vertical arm avoiding lateral shift during bonding
- Small footprint on open platform
Key Benefits
- Open platform with simple user interface on touchscreen
- Quick start for new applications
- Superimposed images for easy manual alignment
- Bonding controlled by the machine to guarantee a high repeatability from sample to sample
Process Capabilities
Main bonding processes
- Flip-chip bonding
- Die bonding
- Pick and place
- Thermocompression
- UV curing
- Reflow
- Gold, Gold/Tin, Indium, Copper