Highlights
- Post-bonding accuracy* (± 0,5 μm)
- Low Force Bonding
- Confining Gas
- Easy to use and very flexible
- Quick set-up of new applications
- Small footprint and compact design
Key Benefits
- Open platform associated to an intuitive interface results in a quick set-up for new applications
- Robust design and closed loop systems guarantee a high repeatability in operations
- High precision, accurate control of low forces and user-friendly interface for multiple applications and processes
Process Capabilities
Main bonding processes
- Flip-chip bonding
- Die bonding
- Pick and place
- Thermocompression
- Reflow
- UV curing
- Gold, Gold/Tin, Indium, Copper
