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Home Semiconductor Manufacturing Packaging, Test & Metrology Device Bonders ACCµRA OPTO: High Accuracy Flip-Chip Bonder 0.5 μm
ACCµRA M: New Manual Flip-Chip Bonder
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ACCµRA100: Education and R&D oriented, High Accuracy Flip-Chip Bonder
SET

ACCµRA OPTO: High Accuracy Flip-Chip Bonder 0.5 μm

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process.

The ACCμRA Opto combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

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Categories: Semiconductor Manufacturing, Device Bonders
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Description

Highlights

  • Post-bonding accuracy* (± 0,5 μm)
  • Low Force Bonding
  • Confining Gas
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Small footprint and compact design

Key Benefits

  • Open platform associated to an intuitive interface results in a quick set-up for new applications
  • Robust design and closed loop systems guarantee a high repeatability in operations
  • High precision, accurate control of low forces and user-friendly interface for multiple applications and processes

Process Capabilities

Main bonding processes

  • Flip-chip bonding
  • Die bonding
  • Pick and place
  • Thermocompression
  • Reflow
  • UV curing
  • Gold, Gold/Tin, Indium, Copper
Additional information
Brand

SET

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