Key Benefits
- High accuracy and high throughput
- Fully automatic
- High flexibility and reliability
- Ultra-small dies
Process Capabilities
- Flip-chip bonding
- Die bonding
- Thermocompression
- Reflow
- UV curing
- Gold, Gold/Tin, Indium, Copper
- Pick & Place
ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications
The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCμRA Plus combines high precision, flexibility and short cycle time.
Description
Additional information
| Brand |
SET |
|---|
You may also like