- High accuracy and high throughput
- Fully automatic
- High flexibility and reliability
- Ultra-small dies
- Flip-chip bonding
- Die bonding
- UV curing
- Gold, Gold/Tin, Indium, Copper
- Pick & Place
The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCμRA Plus combines high precision, flexibility and short cycle time.
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