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Home Semiconductor Manufacturing Packaging, Test & Metrology Device Bonders ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications
ACCµRA100: Education and R&D oriented, High Accuracy Flip-Chip Bonder
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NEO HB: New Automatic Flip-Chip Bonder, Hybrid/ Direct
SET

ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications

The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCμRA Plus combines high precision, flexibility and short cycle time.

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Categories: Semiconductor Manufacturing, Device Bonders
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Description

Key Benefits

  • High accuracy and high throughput
  • Fully automatic
  • High flexibility and reliability
  • Ultra-small dies

Process Capabilities

  • Flip-chip bonding
  • Die bonding
  • Thermocompression
  • Reflow
  • UV curing
  • Gold, Gold/Tin, Indium, Copper
  • Pick & Place
Additional information
Brand

SET

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  • HOME
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