Highlights
- Post-bonding accuracy* (± 0,5 μm)
- Easy to use and very flexible
- Quick set-up of new applications
- Cost-effective
- Small footprint and compact design
- High bonding force
Key Benefits
- Open platform associated to an intuitive interface results in a quick set-up for new applications
- Robust design and closed loop systems guarantee a high repeatability in operations
- It combines on the same platform high precision, low to high force and user-friendly interface for multiple applications and processes
Process Capabilities
Main bonding processes
- Flip-chip bonding
- Die bonding
- Pick and place
- Thermocompression
- Thermosonic
- UV curing
- Reflow
- Gold, Gold/Tin, Indium, Copper
- UV or thermal cure adhesives
- Polymers