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Home Semiconductor Manufacturing Packaging, Test & Metrology Device Bonders ACCµRA100: Education and R&D oriented, High Accuracy Flip-Chip Bonder
ACCµRA OPTO: High Accuracy Flip-Chip Bonder 0.5 μm
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ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications
SET

ACCµRA100: Education and R&D oriented, High Accuracy Flip-Chip Bonder

The ACCµRA™100 is a semi-automatic flip-chip bonder that guarantees ± 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.

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Categories: Semiconductor Manufacturing, Device Bonders
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Description

Highlights

  • Post-bonding accuracy* (± 0,5 μm)
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Cost-effective
  • Small footprint and compact design
  • High bonding force

Key Benefits

  • Open platform associated to an intuitive interface results in a quick set-up for new applications
  • Robust design and closed loop systems guarantee a high repeatability in operations
  • It combines on the same platform high precision, low to high force and user-friendly interface for multiple applications and processes

Process Capabilities

Main bonding processes

  • Flip-chip bonding
  • Die bonding
  • Pick and place
  • Thermocompression
  • Thermosonic
  • UV curing
  • Reflow
  • Gold, Gold/Tin, Indium, Copper
  • UV or thermal cure adhesives
  • Polymers
Additional information
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  • HOME
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